Etching Principle And Process Flow

Etching is a technique in which materials are removed using chemical reaction or physical impact. Etching techniques can be divided into wet etching and dry etching.

It was first used to manufacture copper plate, zinc plate and other printing embossing plates. It was also widely used to reduce the weight of instrument panels, nameplates, and the processing of thin workpieces that are difficult to process by traditional processing methods; after continuous improvement and technological equipment development, it can also be used It is used in the processing of precision etching products for electronic thin parts in the aviation, machinery, and chemical industries. Especially in the semiconductor manufacturing process, etching is an indispensable technology.

Principle of Etching

Generally referred to as etching is also called photochemical etching, which refers to the removal of the protective film of the area to be etched after exposure to plate making and development, and contact with chemical solutions during etching to achieve the effect of dissolving and corroding, forming unevenness or hollowing out.

Process flow

Exposure method: The project prepares the material size according to the graphics-material preparation-material cleaning-drying → filming or coating → drying → exposure → developing → drying-etching → stripping → OK

Screen printing method: cutting → cleaning the plate (stainless steel and other metal materials) → screen printing → etching → stripping → OK

Etching excellent version: Use inkjet printing technology to print the anti-corrosion ink on the surface of the material, and then cure it (usually light curing or thermal curing) to obtain the anti-corrosion layer and then proceed to the next step of chemical corrosion or electric corrosion.