Ecuadorian customer ordered chemical etching machines

In July 2022, HOT SALES, etching machine，etching machine, shearing machine and exposure machine are packed for delivering to customer in Ecuador. 

Etching machines can be divided into chemical etching machines and electrolytic etching machines. In chemical etching, chemical solution is used to achieve the purpose of etching through chemical reaction. Chemical etching machine is a technology that removes materials by chemical reaction or physical impact.

Exposure machines are usually divided into three categories according to the ease of use: automatic exposure machines, semi-automatic exposure machines, and manual exposure machines.

Photolithography refers to the process of using light to make a pattern (process), layering glue on the surface of the silicon wafer, and then transferring the pattern on the mask to the photoresist to temporarily "copy" the device or circuit structure to the silicon. The entire process on-chip.

Lithography machine is also known as: mask alignment exposure machine, exposure system, lithography system, etc. Under normal circumstances, the lithography process needs to go through the steps of surface cleaning, drying, primer coating, spin coating photoresist, soft baking, alignment, exposure, post-baking, developing, hard baking, and etching.

Contact Exposure (Contact Printing): The mask is in direct contact with the photoresist layer. The exposed graphics have the same resolution as the graphics on the mask. The equipment is simple, contact type, and can be divided into soft contact, hard contact and vacuum contact according to the way of applying force. Soft contact is to adsorb the substrate through the tray (similar to the placement of the substrate in the glue machine), and the mask is placed on the substrate; hard contact is to pass the substrate through an air pressure (nitrogen), and push it upward to make it Contact with the mask; vacuum contact is to pump air between the mask and the substrate to make it fit better (think about the way to place the quilt in a vacuum) soft<hard<The tighter the vacuum contact, the better the resolution High, of course, the tighter the contact, the greater the damage to the mask and material.

Proximity Printing: The mask and the photoresist base layer retain a tiny gap (Gap), and the Gap is about 0 to 200 μm. It can effectively avoid the damage of the mask plate caused by direct contact with the photoresist, so that the mask and the photoresist substrate can be used for a long time; Proximity is the most widely used in modern lithography processes.

Projection Printing: Exposure is achieved by using an optical system to concentrate light between the mask and the photoresist. Generally, the size of the mask will be 4 times the size of the pattern to be transferred. Advantages: The resolution is improved, the mask plate is easier to make, and the effect of defects on the mask plate is reduced.