American customer order 120 pcs etching zinc plates and Corrosion Additives

In Sep. Hot Sales, 120 pcs etching zinc plates and two barrels corrosion additives are packed for delivering to our customer in America. High quality etching magnesium plates with good packaging.

Acid etching, also known as copper chloride acid etching system, is usually used for single-sided etching, inner layer etching or outer layer etching of multi-layer boards. Because these processes all use dry film or liquid photosensitive ink as etching resist, and these photosensitive materials are relatively resistant to acid and not alkali, acid etching is selected.

Introduction of Acid Etching System Types

1. Ferric chloride etching solution:

Its regeneration is difficult, the pollution is serious, the waste liquid is difficult to handle, etc. and is being eliminated (Fe3+>50%).

2. Sulfuric acid-hydrogen peroxide etching solution:

Due to the low etching speed, it is generally used for pattern plating, pre-treatment of internal and external lamination films (suitable for thin copper).

3. Chlorate etching solution:

It has the characteristics of stable etching speed, large amount of dissolved copper, easy regeneration and recovery of etching solution, and can reduce pollution.

Introduction to Chlorate System

1. The main components of acid etching solution: HCl (hydrochloric acid), NaClO3 (sodium chlorate) and additives

2. At present, the acid etching solution regenerating agent produced by the company is mainly CC-228, which is mainly sodium hypochlorite, and the concentrated etching solution with special additives is added. During the production operation, it is operated with low acid equivalent. Chlorine gas, and get a better etching factor.

3. CC-228 can replace hydrogen peroxide in most acid etching of copper chloride, avoid the stability control problem of hydrogen peroxide, and is safer than hydrogen peroxide. With automatic addition system, it will become the most economical and safe copper chloride. Etching regeneration system.

Feature

1. Simple control and safe operation.

2. Low acid operation, stable medicinal properties.

3. The side etching is low, and the etching factor can be made above 5-8.

4. It is suitable for precision circuit etching, and there is no problem in etching with 2/2 line width and line spacing.

5. Recycling, low cost.

Principle of acid etching reaction (taking NaClO3/HCl system as an example)

1. Copper etching reaction: Copper can exist in three oxidation states, metal copper Cu on the board surface, blue ion Cu2+ in the etching bath, and the less common cuprous ion Cu+. Metal copper Cu can be oxidized and dissolved by Cu2+ in the etching bath, see the following reaction formula (1)

3Cu + 3CuCl2 → 6CuCl ------------- (1)

2. Regeneration reaction: The metal copper Cu is oxidized and dissolved by the Cu2+ in the etching bath, and the generated 2Cu+ is oxidized into Cu2+ by the oxidant and HCl automatically added into the etching bath through a series of reactions, and these Cu2+ continue to follow the plate The metal copper Cu on the surface reacts, so that the etching solution can bite off more metal copper Cu. This is the cyclic regeneration reaction of the etching solution, see the following reaction formula (2)

6CuCl + NaClO3 + 6HCl → 6CuCl2 + 3H2O + NaCl ------(2)

3. Net reaction:

3Cu + NaClO3 + 6HCl → 3CuCl2 + 3H2O + NaCl --------(3)